Heat Transfer Enhancement of Copper-Water Nanofluids in a Lid-Driven Enclosure with Two Mutually Orthogonal Heated Plates
Heat Transfer Enhancement of Copper-Water Nanofluids in a Lid-Driven Enclosure with Two Mutually Orthogonal Heated Plates
复制标题
DOI：
10.4028/www.scientific.net/amr.268-270.263
复制
发表时间：
2011-07
期刊：
影响因子：
--
通讯作者：
X. Wang;Dingfang Li;Feng Hui
中科院分区：
文献类型：
--
作者：
X. Wang;Dingfang Li;Feng Hui
本文介绍了混合对流的数值研究的结果，在盖子驱动的封闭充满了铜-水纳米流体和两个相互正交的加热薄板诱导。考虑了两种不同的边界条件（等温边界条件和等通量边界条件）。耦合gonverning方程数值求解的全四阶精度紧致差分方法。进行了参数研究和一组图形的结果，并进行了讨论，以阐明显着的传热增强，可以得到由于纳米粒子的存在。
This paper presents the results of a numerical study on the mixed convection in a lid-driven enclosure filled with a copper-water nanofluid and induced by two mutually orthogonal heated thin plates. Two different boundary conditions (isothermal boundary condition and isoflux boundary condition) are considered. The coupled gonverning equations are solved numerically by a fully fourth-order accurate compact finite difference method. A parametric study is conducted and a set of graphical results is presented and discussed to elucidate that significant heat transfer enhancement can be obtained due to the presence of nanoparticles.