Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates
Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates
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DOI：
10.1007/s10854-019-02358-x
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发表时间：
2019-10-19
影响因子：
2.8
通讯作者：
Searle, Justin
中科院分区：
文献类型：
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作者：
Abbas, Bahaa;Mohammad, Youmna;Searle, Justin
铜油墨可能为印刷电子电路提供一种成本效益高的银替代品。在基于玻璃的应用中，如光伏或智能玻璃，它可以提供一种增强导电性或额外功能的手段。系统地研究了三种由纳米和微铜颗粒混合组成的油墨，考察了烧结温度、烧结时间和气体环境对FTO镀膜玻璃上烧结印刷薄膜电学质量的影响。在油墨的微粒性质、烧结条件和薄膜的导电性能之间存在着明确的相互作用。仅含有纳米颗粒的薄膜在225℃烧结60分钟的最佳条件下提供了最导电的薄膜。微颗粒的掺入提高了理想烧结温度，但降低了烧结时间。含有纳米颗粒和微颗粒混合的墨水表现出最低的性能，这可以归因于纳米颗粒沿着导电路径的部分氧化，这是由于微颗粒的存在而发生的。
Copper inks potentially provide a cost effective replacement to silver for printed electronic circuits. In glass based applications such as PV or smart glass, it can provide a means of conductivity enhancement or additional functionality. Three inks consisting of a mixture of nano and micro copper particles were systematically studied to examine the relationship between sintering temperature, sintering time and gaseous environment on the electrical qualities of the sintered printed films deposited on FTO coated glass. There is a definite interaction between the particulate nature of the ink, the sintering conditions and the conductive properties of the film. Films containing only nano-particles provide the most conductive films with optimum sintering conditions of temperatures of 225 degrees C for 60 min. The inclusion of micro particles increased the ideal sintering temperature but lowered the sintering time. An ink containing an equal mixture of nano and micro particles exhibited the lowest performance and this could be attributed to partial oxidation of the nano-particles along the conductive path, which occurs as a result of the presence of the micro particles.