Strain measurement by three-dimensional electronic speckle pattern interferometry: potentials, limitations, and applications
Strain measurement by three-dimensional electronic speckle pattern interferometry: potentials, limitations, and applications
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DOI：
10.1117/1.1566781
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发表时间：
2003-05
影响因子：
1.3
通讯作者：
Lianxiang Yang;A. Ettemeyer
中科院分区：
文献类型：
--
作者：
Lianxiang Yang;A. Ettemeyer
介绍了三维电子散斑干涉法(3DESPI)用于应变和应力分析的原理和新进展。讨论了它的潜力和局限性，并给出了一些在工业上的应用。新开发的三维电子散斑干涉技术可以快速测量复杂工业部件的形状和三维变形。形状和变形的组合为准确和定量确定真实应变提供了所有必要的数据，因此几乎所有工业部件上的应力都是如此。基于轻巧紧凑的传感器设计和新的玻璃纤维概念，新设备已大大微型化，并可在测试期间轻松安装到组件上。它非常适合在真实测试世界中经常发现的恶劣环境条件。
Principles and new developments of 3-D electronic speckle pattern interferometry (3-D ESPI) for strain and stress analysis are presented. The potentials and limitations are discussed, and some applications used in industry are shown. The newly developed 3-D ESPI technique allows rapid measurement of both the shape and the 3-D deformation of complex industrial components. The combination of shape and deformation provides all the necessary data for the accurate and quantitative determination of true strain and thus stress on nearly any industrial component. Based on a lightweight compact sensor design and new glass fiber concepts, the new device has been greatly miniaturized and can be easily attached to the components during testing. It is well suited for the harsh environmental conditions often found in the real test world.