Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature
Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature
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DOI：
10.1108/ssmt-04-2022-0028
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发表时间：
2022-08
期刊：
影响因子：
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通讯作者：
Gui-Sheng Gan;Shi-Qi Chen;Liujie Jiang;Zhaoqi Jiang;Cong Liu;P. Ma;Dayong Cheng;Xin Liu
中科院分区：
文献类型：
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作者：
Gui-Sheng Gan;Shi-Qi Chen;Liujie Jiang;Zhaoqi Jiang;Cong Liu;P. Ma;Dayong Cheng;Xin Liu
目的本研究旨在评估热老化温度对Cu/Cu接头性能的影响。设计/方法/途径采用一种新方法，将1μm Zn颗粒和粒径为25-38μm的Sn-0.3Ag-0.7Cu（SAC0307）混合填充接头，并成功实现低温超声辅助下Cu/Cu的微连接，然后研究热老化温度对Cu/Cu接头性能的影响。结果发现时效过程中Cu/SACZ/Cu接头上下界面金属间化合物(IMCs)的成分保持不变，为Cu5Zn8，且Cu/SACZ/Cu接头上下界面金属间化合物的厚度相应增加。与收到的接头相比，在150℃焊接老化24 h后，上、下界面IMC的厚度分别增加了404.7%和505.5%。下界面的IMCs形成趋势和IMCs生长速率均大于上界面，因为收到的接头的上下界面IMCs附近的焊缝分别主要是白色SAC0307球和黑色Zn颗粒。上下界面IMCs的生长活化能分别约为89.21和55.11 kJ/mol。相同时效时间下，随着时效温度的升高，Cu/SACZ/Cu接头的剪切强度在150℃之前没有明显变化。当时效温度达到150℃时，接头的剪切强度明显下降；接头的剪切强度在150℃、24 h时最小，比原态接头的剪切强度降低了39.4%，这是因为随着时效温度和时间的增加，接头中Zn颗粒的氧化程度增加。在低温超声辅助下成功实现了独创性/有价值的铜/铜接头。
Purpose This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Cu joints. Design/methodology/approach A new method that 1 um Zn-particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved the micro-joining of Cu/Cu under ultrasonic-assisted at low-temperature, and then the effect of thermal aging temperature on the properties of Cu/Cu joints was researched. Findings The composition of the intermetallic compounds (IMCs) on the upper and lower interfaces of Cu/SACZ/Cu joints remained unchanged, which was Cu5Zn8 in aging process, and the thickness of the IMCs on the upper and lower interfaces of the Cu/SACZ/Cu joints increased accordingly. Compared with the as-received joints, the thickness of the upper and lower interfaces IMCs of the soldering aged time for 24 h increased by 404.7% and 505.5% at 150ºC, respectively. The IMCs formation tendency and the IMCs growth rate of the lower interface are larger than those of the upper interface because the soldering seam near the IMCs at the upper and lower interfaces of the as-received joints were mostly white SAC0307 balls black Zn-particles, respectively. The growth activation energy of IMCs in the upper and lower interfaces is about 89.21 and 55.11 kJ/mol, respectively. Under the same aging time, with the increase of the aging temperature, the shear strength of Cu/SACZ/Cu joints did not change significantly at first before 150ºC. When the aging temperature reached 150ºC, the shear strength of the joints decreased significantly; the shear strength of the joints was the smallest at 150ºC for 24 h, which was 39.4% lower than that of the as-received joints because the oxidation degree of Zn particles in the joint with the increase of aging temperature and time. Originality/value Cu/Cu joints were successfully achieved under ultrasonic-assisted at low-temperature.