Enabling large-scale deployment of photonics through cost-efficient and scalable packaging
Enabling large-scale deployment of photonics through cost-efficient and scalable packaging
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通过经济高效且可扩展的封装实现光子学的大规模部署
DOI：
10.1109/group4.2015.7305910
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发表时间：
2015
期刊：
影响因子：
--
通讯作者：
P. Fortier
中科院分区：
文献类型：
--
作者：
T. Barwicz;Y. Taira;Ted W. Lichoulas;N. Boyer;H. Numata;Y. Martin;J. Nah;S. Takenobu;Alexander Janta;E. Kimbrell;R. Leidy;M. Khater;S. Kamlapurkar;S. Engelmann;Y. Vlasov;P. Fortier
在高通量微电子设备中实现单模光子封装可以显著提高成本和可扩展性。我们实验证明，这种解决方案使用12光纤接口和倒装芯片激光器。我们测量了-1.3dB峰值光纤到芯片传输。
Enabling single-mode photonic packaging in high-throughput microelectronic equipment can dramatically improve cost and scalability. We experimentally demonstrate such solution using 12-fiber interfaces and flipped-chip lasers. We measure -1.3dB peak fiber-to-chip transmission.