Self‐assembly of colloidal nanoparticles into encapsulated hollow superstructures
Self‐assembly of colloidal nanoparticles into encapsulated hollow superstructures
复制标题
将胶体纳米颗粒自组装成封装的中空上部结构
作者：
Wu, Chaolumen;Li, Zhiwei;Bai, Yaocai;To, Dung;Myung, Nosang V.;Yin, Yadong
作为一种独特类型的纳米胶囊，无机纳米粒子的中空超结构由于其可控的渗透性、方便的功能化和高效的表面利用而引起了越来越多的关注。传统上，它们是通过在昂贵的牺牲模板上组装纳米颗粒来生产的。本文报道了一种基于乳液的通用方法，将胶体纳米颗粒组装成亚微米中空超结构，首先将胶体纳米颗粒与有机添加剂共组装形成簇，然后用聚合物壳覆盖簇，最后通过暴露于良溶剂中去除有机添加剂并重新分散纳米颗粒。该过程成功的关键是在溶剂蒸发过程中毛细管力的驱动下，纳米粒子在聚合物壳上重新组装，产生中空的上部结构。这种空间受限的组装过程可以通过选择溶剂及其蒸发速率来很好地控制。这种通用技术提供了一个开放且低成本的平台，用于创建各种无机纳米颗粒的中空超结构，为探索可以利用组成纳米颗粒和可渗透纳米壳结构的集体特性的独特应用提供了许多机会。
As a distinct type of nanocapsules, hollow superstructures of inorganic nanoparticles have attracted increasing attention due to their controllable permeability, convenient functionalization, and efficient surface utilization. Conventionally, they are produced by assembling nanoparticles against expensive sacrificial templates. Herein, a general emulsion‐based method is reported to assemble colloidal nanoparticles into submicron hollow superstructures, involving first co‐assembly of colloidal nanoparticles with organic additives to form clusters, then overcoating the clusters with a polymer shell, and finally removing the organic additives and re‐dispersing nanoparticles by exposing to a good solvent. The key to the success of this process is the re‐assembly of nanoparticles against the polymer shells as driven by the capillary force during solvent evaporation, producing hollow superstructures. Such a space‐confined assembly process can be well controlled by choice of solvents and their evaporation rates. This general technique provides an open and low‐cost platform for creating hollow superstructures of various inorganic nanoparticles, offering many opportunities for exploring unique applications that can take advantage of the collective properties of the constituent nanoparticles and the permeable nanoshell structures.
研究导致超细非晶 fe100−xcx 合金颗粒形成的化学反应
DOI：
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发表时间：
1988
期刊：
影响因子：
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作者：
Jacques van Wonterghem;S. Mørup;Stuart W. Charles;S. Wells
通讯作者：
S. Wells