Evaluation of SF<sub>6</sub> Reactive Ion Etching Performance with a Permanent Magnet Located behind the Substrate based on a Simple Design Concept
Evaluation of SF<sub>6</sub> Reactive Ion Etching Performance with a Permanent Magnet Located behind the Substrate based on a Simple Design Concept
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基于简单设计概念评估位于基板后面的永磁体的 SF<sub>6</sub> 反应离子蚀刻性能
DOI：
10.3131/jvsj2.59.11
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发表时间：
2016
期刊：
影响因子：
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通讯作者：
Fumihiko Uesugi and Akira Ando
中科院分区：
文献类型：
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作者：
Taisei Motomura;Kazunori Takahashi;Yuji Kasashima;Kazuya Kikunaga;Fumihiko Uesugi and Akira Ando
