Molecular dynamics simulations of heat and momentum transfer at a solid-fluid interface: Relationship between thermal and velocity slip
Molecular dynamics simulations of heat and momentum transfer at a solid-fluid interface: Relationship between thermal and velocity slip
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DOI：
10.1016/j.ijheatmasstransfer.2006.03.005
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发表时间：
2006-09-01
影响因子：
5.2
通讯作者：
Yethiraj, Arun
中科院分区：
文献类型：
--
作者：
Khare, Rajesh;Keblinski, Pawel;Yethiraj, Arun
用分子动力学模拟方法研究了模型固液界面在层流剪切流作用下的热阻。两种模型液体--单原子液体和由20个重复单元组成的聚合物液体--被限制在由与单体相同的原子组成的理想化晶格面之间。我们发现，在固液界面没有速度滑移(不连续)的情况下，质量流不会影响界面热阻，但速度滑移的存在会使界面热阻增加约两倍。(C)2006爱思唯尔有限公司。保留所有权利。
The thermal resistance of a model solid-liquid interface in the presence of laminar shear flow is investigated using molecular dynamics simulations. Two model liquids - a monoatomic liquid and a polymeric liquid composed of 20 repeat units - are confined between walls which are modeled as idealized lattice surfaces composed of atoms identical to the monomers. We find that in the absence of a velocity slip (discontinuity) at the solid-fluid interface, the mass flow does not affect the thermal interfacial resistance, but the presence of velocity slip results in an increase in the interfacial thermal resistance by about a factor of two. (c) 2006 Elsevier Ltd. All rights reserved.