Comparative study of the dentin bond strength of a new universal adhesive
Comparative study of the dentin bond strength of a new universal adhesive
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DOI:
10.4012/dmj.2015-422
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发表时间:
2016-08-01
影响因子:
2.5
通讯作者:
Kim, Duck-Su
中科院分区:
文献类型:
--
作者:
Jang, Ji-Hyun;Lee, Myoung Geun;Kim, Duck-Su
This study compared the dentin bond strength of a new universal adhesive with that of contemporary multi-step dentin adhesives. Six experimental groups were prepared according to the adhesives used and their application modes: Optibond FL (OB), Adper Single Bond Plus (SB), One-Step Plus (OS), Clearfil SE Bond (CS), All-Bond Universal using etch-and-rinse mode (ABE), and All Bond Universal using self-etch mode (ABS). Micro-tensile bond strength (mu TBS) and failure mode were evaluated for each group. The bonded interface was analyzed using transmission electron microscopy (TEM). As a result, mu TBS of 6 experimental groups was followed as: OB=ABE=SE=ABS>SB>OS group. TEM micrographs of ABE and ABS groups revealed a homogenous adhesive layer formation. In conclusion, a new universal adhesive can make reliable bond to dentin, regardless of the application mode.