Bonding of glass-based microfluidic chips at low- or room-temperature in routine laboratory
Bonding of glass-based microfluidic chips at low- or room-temperature in routine laboratory
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DOI：
10.1016/j.snb.2005.11.052
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发表时间：
2006-11-24
影响因子：
8.4
通讯作者：
Wang, Yiming
中科院分区：
文献类型：
--
作者：
Chen, Lingxin;Luo, Guoan;Wang, Yiming
提出了一种无需清洁环境和程控高温炉的低温或室温键合玻璃基微流控芯片的制备方法。基础预处理后，将待粘合的玻璃基片和盖板依次用浓硫酸浸泡，用大流量自来水、去离子水洗涤，并以HF蒸汽作为必要步骤进行处理。最后，通过在连续的去离子水流下或直接用HF蒸汽处理并在低温（< 100℃）或室温下退火，使清洁过的表面紧密接触来粘合板。通过工艺优化、栅格通道设计和高频蒸汽处理等关键改进，可以快速、简便地获得高键合率（> 90%）的玻璃基芯片。采用扫描电镜（SEM）、剪切强度测试和不同外加电压下的电流测量等方法对芯片的粘接质量进行了评价。强结合强度的机理可能与玻璃板在酸或水中长时间浸泡后在其表面形成水解层有关。采用上述方法结合的微流控芯片对单功能活性染料cy5标记生物胺的CE分离进行了评价。(c) 2005 Elsevier B.V.版权所有
A low- or room-temperature bonding method was developed for fabrication of glass-based microfluidic chips without the requirement of clean environment and programmed high-temperature furnaces. After fundamental pretreatments, the glass substrates and cover plates to be bonded were sequentially soaked in concentrated sulfuric acid, washed with high-flow-rate tap water, de-ionized water and treated using HF steam as a necessary step. Finally, the plates were bonded by bringing the cleaned surfaces into close contact either under a continuous flow of de-ionized water or directly when treated with HF steam, and annealing at low-temperature (< 100 degrees C) or room-temperature. With the key improvements such as fabrication process optimization, gridding channel design and HF steam treatment, the glass-based chips could be obtained with fast, easy and high bonding yields (> 90%). The bonding quality of the chips was evaluated by employing SEM, shear strength testing procedure and electric current measurement at different applied voltages. The mechanism for the strong bonding strength was presumably related to the formation of a hydrolyzed layer on the glass plate surfaces after soaking them in acid or water for extended periods. Microfluidic chips bonded by the above method were evaluated in the CE separation of monofuctional reactive dye Cy5-labeled bioamines. (c) 2005 Elsevier B.V. All rights reserved.