A Sub-0.2°/hr Bias Drift Micromechanical Silicon Gyroscope With Automatic CMOS Mode-Matching
A Sub-0.2°/hr Bias Drift Micromechanical Silicon Gyroscope With Automatic CMOS Mode-Matching
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DOI：
10.1109/jssc.2009.2016996
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发表时间：
2009-05-01
影响因子：
5.4
通讯作者：
Ayazi, Farrokh
中科院分区：
文献类型：
--
作者：
Sharma, Ajit;Zaman, Mohammad Faisal;Ayazi, Farrokh
本文介绍了一种系统架构和CMOS实现，利用固有的高机械品质因数（Q）的MEMS陀螺仪，以提高性能。所提出的时域方案利用陀螺仪中经常被忽略的残余正交误差来实现并保持完美的模式匹配（即，类似于高Q驱动和感测模式频率之间的0 Hz分离），以及电子地控制传感器带宽。一个CMOS集成电路和控制算法已接口与60 μ m厚的硅模式匹配音叉陀螺仪（M-2-TFG）实现角速率传感微系统的偏置漂移为0.16度/hr. The建议的技术允许微系统的可重构性-传感器可以工作在一个传统的低通模式为更大的带宽，或在匹配模式为低噪声。最大实现的传感器Q为36，000，并且微传感器的带宽可以通过机械频率的电子控制在1至10 Hz之间变化。陀螺仪的最大比例因子为88 mV/degree/s。该3 V IC采用标准0.6 μ m CMOS工艺制造，功耗6 mW，芯片面积2.25 mm（2）。
This paper describes a system architecture and CMOS implementation that leverages the inherently high mechanical quality factor (Q) of a MEMS gyroscope to improve performance. The proposed time domain scheme utilizes the often-ignored residual quadrature error in a gyroscope to achieve, and maintain, perfect mode-matching (i.e., similar to 0 Hz split between the high-Q drive and sense mode frequencies), as well as electronically control the sensor bandwidth. A CMOS IC and control algorithm have been interfaced with a 60 pm thick silicon mode-matched tuning fork gyroscope (M-2-TFG) to implement an angular rate sensing microsystem with a bias drift of 0.16 degrees/hr. The proposed technique allows microsystem reconfigurability-the sensor can be operated in a conventional low-pass mode for larger bandwidth, or in matched mode for low-noise. The maximum achieved sensor Q is 36,000 and the bandwidth of the microsensor can be varied between 1 to 10 Hz by electronic control of the mechanical frequencies. The maximum scale factor of the gyroscope is 88 mV/degrees/s. The 3 V IC is fabricated in a standard 0.6 mu m CMOS process and consumes 6 mW of power with a die area of 2.25 mm(2).