Embedding of Chips for System in Package realization - Technology and Applications
Embedding of Chips for System in Package realization - Technology and Applications
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DOI：
10.1109/impact.2008.4783892
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发表时间：
2008-10
期刊：
影响因子：
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通讯作者：
L. Boettcher;D. Manessis;A. Ostmann;S. Karaszkiewicz;H. Reichl
中科院分区：
文献类型：
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作者：
L. Boettcher;D. Manessis;A. Ostmann;S. Karaszkiewicz;H. Reichl
在本文中，将描述包和系统级封装（SIP）与嵌入式组件的实现。将半导体芯片嵌入到衬底中具有若干优点。由于可以顺序堆叠包含嵌入式组件的多个层，因此它允许非常高度的小型化。另一个优点是通过短的和几何上良好控制的互连的有益的电性能。此外，嵌入给芯片提供了均匀的机械环境，导致良好的可靠性。由于对在工业环境中实施嵌入技术的兴趣日益增加，一个新成立的欧洲项目“爱马仕”将主要关注嵌入技术的工业适应，并进一步提高原型水平的现有技术能力。其目标是实现一种新的集成制造概念，为高密度电子系统提供低成本的解决方案。组件嵌入技术的工业化带来了新的制造和技术挑战。新工艺应将联合收割机PCB（印刷电路板）技术和模具组装结合在一个生产过程中，以最大限度地受益于大面积加工和高密度封装。
In this paper the realization of packages and system-in-packages (SIP) with embedded components will be described. Embedding of semiconductor chips into substrates has several advantages. It allows a very high degree of miniaturization due to the possibility of sequentially stacking of multiple layers containing embedded components. A further advantage is the beneficial electrical performance by short and geometrically well controlled interconnects. In addition the embedding gives a homogeneous mechanical environment of the chips, resulting in good reliability. As a result of the increasing interest in implementing embedding technologies in an industrial environment a newly established European project "HERMES" will focus mainly on industrial adaptation of embedding technologies with an additional scope of furthering also the existing technological capabilities at prototype level. The goal is to realize a new integrated manufacturing concept to offer low cost solutions for high density electronic systems. New manufacturing and technological challenges arise from the industrialization of component embedding technologies. The new process should combine PCB (printed circuit board) technology and die assembly in one production process in order to benefit the most from large-area processing and high-density packaging.