Deformation behavior of Mg-Zn-Y alloys reinforced by icosahedral quasicrystalline particles
Deformation behavior of Mg-Zn-Y alloys reinforced by icosahedral quasicrystalline particles
复制标题
DOI：
10.1016/s1359-6454(02)00067-8
复制
发表时间：
2002-05-24
期刊：
影响因子：
9.4
通讯作者：
Kim, WT
中科院分区：
文献类型：
--
作者：
Bae, DH;Kim, SH;Kim, WT
采用形变热处理工艺制备了准晶颗粒增强的富镁Mg-Zn-Y合金。研究了这些合金在室温和高温下的变形行为。这些合金的屈服强度随着准晶颗粒的体积分数的增加而增加，由于它们的强化作用而相对较高。合金中流动应力的变化特征在于与高温变形过程中的显微组织演变相联系。流动软化与位错攀移控制蠕变下发展的动态再结晶有关;流动硬化与晶界扩散控制蠕变下发生的晶粒生长有关。Mg-Zn-Y合金中的准晶颗粒由于它们的低界面能而抵抗粗化，从而形成稳定的准晶颗粒/基体界面，并且还阻止在高达共晶温度附近的温度下变形期间α-Mg基体的显微结构演变。Mg-Zn-Y合金中准晶颗粒和基体微观结构的稳定性提供了大的断裂伸长率，在准晶颗粒/基体界面处没有空隙形成。(C)2002 Acta Materialia Inc.由爱思唯尔科技有限公司出版。保留所有权利。
New Mg-rich Mg-Zn-Y alloys, reinforced by quasicrystalline particles, have been developed by thermomechanical processes. The deformation behavior of these alloys at room and elevated temperatures has been investigated. Yield strength of these alloys, which increases with an increase in the volume fraction of quasicrystalline particles, is relatively high due to their strengthening effect. The variation of the flow stress in the alloys is characterized by linking the microstructural evolution during deformation at high temperatures. The flow softening is related to dynamic recrystallization developed under the dislocation climb controlled creep; the flow hardening is related to grain growth that occurs under the grain boundary diffusion controlled creep. Quasicrystalline particles in the Mg-Zn-Y alloys resist coarsening due to their low interfacial energy, thereby forming of stable quasicrystalline particle/matrix interface and also prohibit against microstructural evolution of the alpha-Mg matrix during deformation at temperatures up to near the eutectic temperature. Stability of both quasicrystalline particles and matrix microstructure in the Mg-Zn-Y alloys provides large elongation to failure with no void formation at the quasicrystalline particle/matrix interface. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.