Transmission line pulsed photo emission microscopy as an ESD troubleshooting method

Transmission line pulsed photo emission microscopy as an ESD troubleshooting method
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传输线脉冲光发射显微镜作为 ESD 故障排除方法

DOI:
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发表时间:
2003
期刊:
2003 Electrical Overstress/Electrostatic Discharge Symposium
影响因子:
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通讯作者:
P. Bruin
P. Bruin
中科院分区:
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文献类型:
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作者:
J. van Zwol;W. Kemper;P. Bruin

文献摘要

被引文献

相似文献

标准或传输线脉冲ESD测试结合故障分析并不总能揭示IC中ESD弱点的原因。本文提出了结合光发射显微镜和TLP作为故障排除工具。两种情况下,这种组合的优势是必不可少的,以解决特定的ESD问题的IC进行了讨论。
Standard or transmission line pulse ESD testing combined with failure analysis will not always reveal the cause of ESD weakness in an IC. The paper proposes the combination of photo emission microscopy and TLP as a troubleshooting tool. Two cases are discussed where the advantage of this combination was essential to solve the particular ESD problem in the IC.