Investigation of long range differential crosstalk on printed circuit boards
Investigation of long range differential crosstalk on printed circuit boards
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DOI：
10.1109/sapiw.2014.6844525
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发表时间：
2014-05
期刊：
影响因子：
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通讯作者：
Torsten Reuschel;S. Muller;H. Bruns;C. Schuster
中科院分区：
文献类型：
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作者：
Torsten Reuschel;S. Muller;H. Bruns;C. Schuster
研究了印刷电路板上大差分过孔阵列中的串扰，包括电源分配结构的影响。对于第一次，本文提供了一个全面的洞察到长距离串扰，即通过阵列中的远端口之间的总有超过3600个过孔。串扰的调查进行了使用一个有效的基于物理的通过模型，以获得完整的S参数描述的所有端口，在300个频率范围从0.1到30 GHz的采样。其中，示例性结果作为二维串扰分布的图给出。不同的安排进行了比较，并进行了深入的讨论。
Crosstalk occurring in large differential via arrays on printed circuit boards is investigated, including the impact of power distribution structures. For the first time, this paper provides a comprehensive insight into long range crosstalk, i.e. between distant ports in via arrays having more than 3600 vias in total. An investigation of crosstalk is carried out using an efficient physics-based via model to obtain a full S-parameter description of all ports, sampled at 300 frequencies across the range from 0.1 to 30GHz. Among others, exemplary results are given as maps of two-dimensional crosstalk distribution. A comparison of different arrangements is given and thoroughly discussed.