Polymer microlayer structures with anisotropic conductivity

Polymer microlayer structures with anisotropic conductivity
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DOI:
10.1023/a:1004527205239
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发表时间:
1999-04-01
影响因子:
4.5
通讯作者:
Baer, E
Baer, E
中科院分区:
材料科学3区
文献类型:
--
作者:
Nazarenko, S;Hiltner, A;Baer, E

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连续多层共挤出提供了一种将金属填充聚合物加工成导电结构的新方法。在此过程中,填充和未填充的聚合物被组合成独特的结构,具有许多由两种或多种成分组成的交替层。总层数可以从数十层到数千层不等。利用微层化“组织”各向异性颗粒的能力来获得具有高度各向异性电性能的金属填充聚丙烯带。与压缩成型相比,通过微分层实现金属薄片的取向将电阻率的各向异性增加了两个数量级。通过交替填充和未填充层来隔离各个填充层,从而产生具有许多独立导电路径的材料。仅当填充层比片状颗粒的厚度厚时,含有 10% (v/v) 铜片或 15% (v/v) 镍片的填充层才具有导电性。当填充层的厚度接近颗粒厚度时,导电性能就丧失了。通过比较厚导电层中薄片的三维排列与薄非导电层中的二维颗粒布局,可以理解这种行为。 (C) 1999 Kluwer 学术出版社。
Continuous layer-multiplying coextrusion offers a new approach for processing metal-filled polymers into conducting structures. In this process, filled and unfilled polymers are combined into unique structures with many alternating layers of two or more components. The total number of layers can range from tens to thousands. The ability of microlayering to "organize" anisotropic particles was used to obtain metal-filled polypropylene tape with highly anisotropic electrical properties. Orientation of metal flakes by microlayering increased the anisotropy in resistivity by two orders of magnitude over compression molding. Isolation of individual filled layers by alternating filled and unfilled layers resulted in materials with many independent conducting pathways. Filled layers with 10% (v/v) copper flakes or 15% (v/v) nickel flakes were conductive only if the filled layers were thick compared to the thickness of the flake particles. When the thickness of the filled layers approached the particle thickness, the conductive properties were lost. This behavior was understood by comparing the three-dimensional arrangement of flakes in thick conductive layers with the two-dimensional particle layout of thin non-conductive layers. (C) 1999 Kluwer Academic Publishers.