Measurement of the common source inductance of typical switching device packages
Measurement of the common source inductance of typical switching device packages
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DOI：
10.1109/ifeec.2017.7992207
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发表时间：
2017-06
期刊：
影响因子：
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通讯作者：
K. Aikawa;Tomohumi Shiida;Ryunosuke Matsumoto;K. Umetani;E. Hiraki
中科院分区：
文献类型：
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作者：
K. Aikawa;Tomohumi Shiida;Ryunosuke Matsumoto;K. Umetani;E. Hiraki
共源电感是半导体开关器件开关速度恶化和误触发敏感性降低的主要原因之一。这种电感的实际设计需要选择合适的半导体封装，因为这种电感在很大程度上依赖于物理封装结构。然而，很少有研究报道商业上可用的封装的共源电感列表。为了列出和比较典型半导体封装中的共源电感，本文对安装在实验电路板上的实际开关器件的共源电感进行了测量。本文采用了最近提出的一种直接适用于安装在印刷电路板上的开关器件的直接测量技术。在此基础上建立了典型封装的共源电感基本数据库。共源极电感主要由封装类型决定。然而，在TO-247和TO-220封装中，由于对额定电流的依赖，发现大约三分之一的总公共源极电感在相同封装的开关器件之间可能不同。对物理封装结构的研究表明，这种依赖关系是由连接半导体芯片和源极端子的键合导线的杂散电感引起的。
The common source inductance is one of the major causes of deterioration of the switching speed and susceptibility of the false triggering for semiconductor switching devices. Practical design of this inductance requires selection of an appropriate semiconductor package because this inductance is greatly dependent on the physical package structure. However, few studies have reported a list of the common source inductance of commercially available packages. In order to list and compare the common source inductance among typical semiconductor packages, this paper carried out measurement of this inductance of actual switching devices mounted on experimental PCBs. This paper employed a recently proposed straightforward measurement technique directly applicable to switching devices mounted on PCBs. As a result, a basic database of the common source inductance of typical packages was presented. The common source inductance was found to be determined mainly by the package type. However, in TO-247 and TO-220 packages, approximately one-third of the total common source inductance was found to possibly vary among the switching devices of the same package due to the dependence on the current rating. Investigation of the physical package structure implied that this dependence was caused by the stray inductance of the bonding wires connecting the semiconductor chip to the source terminal.