Electromigration in Bi-crystal pure Sn solder joints: Elucidating the role of grain orientation
Electromigration in Bi-crystal pure Sn solder joints: Elucidating the role of grain orientation
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DOI：
10.1016/j.jallcom.2019.152918
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发表时间：
2020-03
影响因子：
6.2
通讯作者：
M. Kelly;S. Niverty;N. Chawla
中科院分区：
文献类型：
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作者：
M. Kelly;S. Niverty;N. Chawla
在β-tetra-Sn焊点中，Cu的各向异性扩散控制了金属间化合物（IMC）和空洞的生长，从而导致了焊点的电迁移损伤。单晶快速扩散，缓慢扩散，和双晶焊点制备和测试下的热老化和EM条件下，调查晶粒取向的微观结构演变，包括IMC生长，空洞生长和晶粒结构的影响。样品和测试几何形状确保没有电流拥挤或焦耳加热的影响，因此可以隔离晶体学效应。通过扫描电子显微镜（SEM），电子背散射衍射（EBSD）和X射线显微断层扫描的微观结构表征揭示界面形核和体形核IMC生长，再结晶晶粒的颗粒刺激成核（PSN），和两个独特的空洞化行为，空洞小面和空洞的洞穴。讨论了这些特征与β-Sn晶粒取向之间的关系以及对EM损伤减轻的影响。
Intermetallic compound (IMC) and void growth are electromigration (EM) damage mechanisms that are controlled by the anisotropic diffusion of Cu in β-tetragonal Sn solder joints. Single crystal fast diffusion, slow diffusion, and bicrystal solder joints were fabricated and tested under thermal aging and EM conditions to investigate the effect of grain orientation on microstructure evolution including IMC growth, void growth and grain structure. Sample and testing geometry ensured there were no effects from current crowding or joule heating so that crystallographic effects could be isolated. Microstructure characterization by scanning electron microscope (SEM), electron backscatter diffraction (EBSD) and X-ray microtomography revealed interface-nucleated and bulk-nucleated IMC growth, particle stimulated nucleation (PSN) of recrystallized grains, and two unique voiding behaviors, void faceting and void burrowing. The relationship between these features and β-Sn grain orientation and implications for EM damage mitigation are discussed.