Microstructural and Electrical Properties of Copper–Titanium Alloy Dispersed with Carbon Nanotubes via Powder Metallurgy Process
Microstructural and Electrical Properties of Copper–Titanium Alloy Dispersed with Carbon Nanotubes via Powder Metallurgy Process
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DOI：
10.2320/matertrans.y-m2013846
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发表时间：
2014-03
影响因子：
1.2
通讯作者：
H. Imai;K. Kondoh;Shufeng Li;J. Umeda;Bunshi Fugetsu;M. Takahashi
中科院分区：
文献类型：
--
作者：
H. Imai;K. Kondoh;Shufeng Li;J. Umeda;Bunshi Fugetsu;M. Takahashi
研究了添加碳纳米管（CNTs）的粉末冶金铜合金的组织和电学性能。采用水雾化法制备了Cu ≤ 0.5mass%Ti预合金粉末（Cu ≤ 0.5Ti）。用含有碳纳米管的两性离子表面活性剂水溶液包覆未成束的碳纳米管粉末，在1223 K真空下进行放电等离子烧结，然后在1073 K下进行挤压。不含CNT的P/ MC μ m 0.5Ti合金（整体合金）具有202 MPa的屈服应力（YS）和42.5的国际退火铜标准%（IACS%）电导率。挤压的Cu 10.0.5Ti复合合金含有碳纳米管显示出较小的降低YS相比，单片Cu 10.0.5Ti合金。另一方面，复合材料的电导率比整体合金的电导率高。例如，具有0.19质量%CNT的Cu/0.5Ti显示出175.8MPa YS和83.5IACS %电导率。TEM EDS分析表明，添加CNTs的Cu ~（2+）0.5Ti复合材料在CNTs周围形成了Cu ~（4+）Ti和TiC等金属间化合物。固溶态Ti在Cu-0.5Ti复合合金基体中的含量约为整体Cu-0.5Ti合金的10%，由于固溶态Ti含量的减少，其电导率显著提高。[doi：10.2320/材料trans.Y-M2013846]
Microstructural and electrical properties of powder metallurgy (P/M) copper alloy with carbon nanotubes (CNTs) were investigated. The Cu0.5mass% Ti pre-alloyed powder (Cu0.5Ti) was made by water atomization process. The powders coated with un-bundled CNTs by using the zwitterionic surfactant water solution containing CNTs were consolidated at 1223K in vacuum by spark plasma sintering, and then extruded at 1073K. The P/ MC u0.5Ti alloy without CNTs (monolithic alloy) had 202MPa yield stress (YS) and 42.5 International-Annealed-CopperStandard % (IACS%) conductivity. The extruded Cu0.5Ti composite alloy containing CNTs revealed small decrease of YS compared to the monolithic Cu0.5Ti alloy. On the other hand, the composites indicated a higher electrical conductivity than that of the monolithic alloy. For example, Cu0.5Ti with 0.19mass% CNTs showed 175.8MPa YS and 83.5 IACS% conductivity. In the case of the Cu0.5Ti composite with CNTs, the intermetallic compounds such as Cu4Ti and TiC were observed around CNTs by TEM-EDS analysis. The amount of the solid solute Ti in the above Cu0.5Ti composite alloy matrix was 10% of the monolithic Cu0.5Ti alloy, and resulted in the remarkable increment of its electrical conductivity due to the decrease of solid solute Ti content. [doi:10.2320/matertrans.Y-M2013846]