Effects of Phosphorus and Copper on Factors Influencing Nutrient Uptake, Photosynthesis, and Grain Yield of Wheat
Effects of Phosphorus and Copper on Factors Influencing Nutrient Uptake, Photosynthesis, and Grain Yield of Wheat
复制标题
磷、铜对小麦养分吸收、光合作用及产量影响因素的影响
DOI：
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发表时间：
1991
期刊：
影响因子：
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通讯作者：
T. G. Arscott
中科院分区：
文献类型：
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作者：
M. Javadi;J. Beuerlein;T. G. Arscott
施用大量磷肥可促进小麦（Triticum aestivum L.）的早期植物生长和产量。这种做法会导致土壤中磷的积累，并减少植物对铜的吸收，从而可能导致叶绿体中质体蓝素浓度的降低。结果，光合作用速率和作物产量可能受到不利影响。虽然泡状丛枝菌根 (VAM) 真菌有时会增强铜的吸收，但土壤磷的大量积累会减少 VAM 增强的铜吸收。在研究地块中施用不同量的磷和铜，以测量它们对小麦叶片中磷、铜和质体蓝素含量的影响。还测量了 VAM 孢子数、叶片光合作用和谷物产量。土壤施磷增加了叶片磷含量，但降低了 VAM 孢子数和光合作用。在土壤中施用铜可以减少 VAM 孢子数量，但没有其他影响。土壤施用磷和铜的综合作用提高了光合速率和谷物产量。正如预期的那样，光合速率随着叶片质体蓝素含量的增加而增加，但籽粒产量与质体蓝素含量或光合速率无关。俄亥俄州 J. SCI。 91 (5): 191-194, 199
Application of large amounts of phosphorus fertilizers is used to enhance early plant growth and yield of wheat (Triticum aestivum L.). This practice can lead to an accumulation of phosphorus in soil and a reduced copper uptake by plants which may result in a reduction of plastocyanin concentrations in chloroplasts. As a result, photosynthetic rates and crop yield can be adversely affected. While copper uptake is sometimes enhanced by vesicular-arbuscular mycorrhizal (VAM) fungi, large accumulations of soil phosphorus can reduce VAM-enhanced copper uptake. Varying amounts of phosphorus and copper were applied to research plots in order to measure their effect on the wheat leaf content of phosphorus, copper, and plastocyanin. VAM spore counts, leaf photosynthesis, and grain yield were also measured. Application of phosphorus to soil increased leaf phosphorus content, but decreased VAM spore count and photosynthesis. Application of copper to soil decreased VAM spore count but had no other effects. The combined effects of soil applied phosphorus and copper increased both photosynthetic rates and grain yield. As expected, photosynthetic rates increased with increasing leaf plastocyanin content, but grain yield could not be related to either plastocyanin content or photosynthetic rates. OHIO J. SCI. 91 (5): 191-194, 199