MECHANICAL-PROPERTIES OF THIN-FILMS
MECHANICAL-PROPERTIES OF THIN-FILMS
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DOI：
10.1007/bf02666659
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发表时间：
1989-11-01
期刊：
影响因子：
--
通讯作者：
NIX, WD
中科院分区：
文献类型：
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作者：
NIX, WD
描述和研究了衬底上薄膜的力学性能。结果表明，在构成集成电路和磁盘的薄膜中可能存在非常大的应力，并且这些应力可能导致变形和断裂发生。本文认为，在块状结构材料研究中已被证明有用的方法可用于理解薄膜材料的力学行为。了解基底上薄膜的机械性能需要了解薄膜结构中的应力以及薄膜变形的机制。回顾了这些过程的基本原理。对于不可变形衬底上的结晶薄膜，一个关键问题涉及到薄膜中位错的运动。对这一问题的分析提供了对外延薄膜中错配位错的形成和衬底上金属薄膜的高强度的深入了解。研究表明，位错在高温下的运动动力学对于理解异质外延结构中错配位错的形成尤为重要。薄膜力学性能的实验研究需要开发和使用非传统的力学测试技术。介绍了最近发展起来的一些技术。激光扫描测量基底曲率是测量薄膜中双轴应力和研究薄膜高温下双轴变形特性的有效方法。介绍了利用纳米压痕器的亚微米压痕检测技术。描述了使用该仪器可以研究的机械性能，包括硬度，弹性模量和随时间变化的变形性能。最后，介绍了一种利用集成电路制造方法对薄膜材料微束样品进行挠度测试的新技术。结果表明，利用该技术可以测量薄膜材料的弹性和塑性性能。
The mechanical properties of thin films on substrates are described and studied. It is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur. It is argued that the approaches that have proven useful in the study of bulk structural materials can be used to understand the mechanical behavior of thin film materials. Understanding the mechanical properties of thin films on substrates requires an understanding of the stresses in thin film structures as well as a knowledge of the mechanisms by which thin films deform. The fundamentals of these processes are reviewed. For a crystalline film on a nondeformable substrate, a key problem involves the movement of dislocations in the film. An analysis of this problem provides insight into both the formation of misfit dislocations in epitaxial thin films and the high strengths of thin metal films on substrates. It is demonstrated that the kinetics of dislocation motion at high temperatures are expecially important to the understanding of the formation of misfit dislocations in heteroepitaxial structures. The experimental study of mechanical properties of thin films requires the development and use of nontraditional mechanical testing techniques. Some of the techniques that have been developed recently are described. The measurement of substrate curvature by laser scanning is shown to be an effective way of measuring the biaxial stresses in thin films and studying the biaxial deformation properties at elevated temperatures. Submicron indentation testing techniques, which make use of the Nanoindenter, are also reviewed. The mechanical properties that can be studied using this instrument are described, including hardness, elastic modulus, and time-dependent deformation properties. Finally, a new testing technique involving the deflection of microbeam samples of thin film materials made by integrated circuit manufacturing methods is described. It is shown that both elastic and plastic properties of thin film materials can be measured using this technique.