FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules
FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules
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FOWLP 技术 eWLB – IoT/IoE 模块封装的推动者
DOI：
10.4071/isom-2015-wa32
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发表时间：
2015
期刊：
影响因子：
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通讯作者：
Nuno Vieira
中科院分区：
文献类型：
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作者：
S. Kroehnert;J. Campos;A. Cardoso;Eoin O’Toole;A. Janeiro;Nuno Vieira
下一个大浪潮，物联网或万物互联（IoT/IoE）即将到来。这对半导体封装、组装和测试意味着什么？有哪些要求？可以提供哪些解决方案？市场将是广泛且分散的。将需要许多不同的解决方案。灵活性和定制系统解决方案的能力至关重要。事实上，这将是所有关于智能系统集成，集成传感器，MEMS，连接和存储器：更多的功能在更小的空间和薄的系统级封装（SiP）和封装上封装（PoP）。物联网/万物互联不会有一种特定的打包技术，也不会有新的“物联网/万物互联打包技术”。工具箱已经存在，满足未来物联网/万物互联模块需求所需的更多功能正在开发中。这实际上是一个好消息，因为成本压力将很高，现有制造环境的实现，成熟和生产的包装技术将是市场竞争的关键。
The next big wave, the Internet of Things or Internet of Everything (IoT/IoE) is on the way. What does that mean for semiconductor packaging, assembly and test? What are the requirements? What solutions can be provided? The market will be wide and fragmented. Many different solutions will be needed. Flexibility and the capability to customize system solutions will be crucial. The fact is, it will be all about smart system integration, integration of sensors, MEMS, connectivity and memory: more functionality on less space in small and thin System-in-Package (SiP) and Package-on-Package (PoP). There will not be one specific packaging technology for IoT/IoE, and no new “IoT/IoE Packaging Technology”. The toolbox is here already, and further features required to meet the needs of future IoT/IoE modules are under development. That is actually good news, as the cost pressure will be high, and materialization of existing manufacturing environment, of mature and yielding packaging technologies will be a key for s...