Enhanced Thermal Diffusivity by Vertical Double Percolation Structures in Polyimide Blend Films Containing Silver Nanoparticles
Enhanced Thermal Diffusivity by Vertical Double Percolation Structures in Polyimide Blend Films Containing Silver Nanoparticles
复制标题
含银纳米粒子的聚酰亚胺共混薄膜中的垂直双渗滤结构增强热扩散率
DOI：
10.1002/macp.201000294
复制
发表时间：
2010
影响因子：
2.5
通讯作者：
S. Ando
中科院分区：
文献类型：
--
作者：
D. Yorifuji;S. Ando
研究了含银纳米粒子（Ag-NPs）的聚酰亚胺（PI）共混膜的面外方向（D方向）沿着热扩散率。以硝酸银为前驱体，通过旋涂和热固化制备了含硫和含氟PI共混膜。薄膜中自发形成了具有“垂直双渗滤（VDP）”形貌的微相分离结构，其中两相沿面外方向沿着排列，银纳米粒子优先沉淀在含硫PI相中。共混物膜表现出更高的D λ值比单相PI膜含有均匀分散的银纳米粒子。这些结果表明，VDP结构作为一个有效的热传导途径。
The thermal diffusivity along the out-of-plane direction (D ⊥ ) in polyimide (PI) blend films containing silver nano particles (Ag-NPs) was investigated. PI blend films composed of a sulfur- and a fluorine-containing PI were prepared via spin-coating and thermal curing of the precursor solutions dissolving silver nitrate. Micro-phase-separated structures with a "vertical double percolation (VDP)" morphology were spontaneously formed in the films, in which two phases are separately aligned along the out-of-plane direction, and Ag-NPs were preferentially precipitated in the sulfur-containing PI phase. The blend films exhibited higher D ⊥ values than monophase PI films containing homogeneously dispersed Ag-NPs. These results indicate that the VDP structure functions as an effective thermal conductive pathway.