Molecular dynamic simulation of F-based reactive ion etching of Si, SiO2 and Si3N4 substrates
Molecular dynamic simulation of F-based reactive ion etching of Si, SiO2 and Si3N4 substrates
复制标题
Si、SiO2和Si3N4基片的F基反应离子刻蚀的分子动力学模拟
DOI:
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发表时间:
2019
期刊:
影响因子:
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通讯作者:
and Satoshi Hamaguchi
中科院分区:
文献类型:
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作者:
Erin Joy Capdos Tinacba;Michiro Isobe;Kazuhiro Karahashi;and Satoshi Hamaguchi