Effect of thickening outermost layers in Al/Ni multilayer film on thermal resistance of reactively bonded solder joints
Effect of thickening outermost layers in Al/Ni multilayer film on thermal resistance of reactively bonded solder joints
复制标题
DOI：
10.7567/jjap.56.06gn16
复制
发表时间：
2017-06-01
影响因子：
1.5
通讯作者：
Namazu, Takahiro
中科院分区：
文献类型：
--
作者：
Kanetsuki, Shunsuke;Kuwahara, Koichi;Namazu, Takahiro
为了降低由Al/Ni自蔓延放热反应获得的焊点的热阻，我们专注于反应前的焊料和反应性Al/Ni多层膜之间的界面。我们制备了一种Al/Ni薄膜，其中最外层的Al或Ni层沉积得更厚。采用激光闪光法结合响应函数分析，测定了最外层加厚和不加厚两种情况下粘接试件的热阻。发现电阻随着最外层的厚度而减小，特别是Ni层。为了研究空隙量对电阻的影响，进行了扫描声层析成像（SAT），扫描电子显微镜（SEM）观察，和场发射电子探针显微分析（FE-EPMA）。镍增厚和铝增厚试样之间的界面状态的差异进行了讨论，在光的焊料润湿性，扩散到焊料，和金属间化合物的类型在焊料界面。可以认为，加厚最外层的Ni层对减少即使在低压接合中在AlNi-焊料界面处产生的空隙的数量具有很大的影响，从而导致焊点的热阻降低。(C)2017日本应用物理学会
To reduce the thermal resistance of solder joints obtained by Al/Ni self-propagating exothermic reaction, we focus on the interface between the solder and the reactive Al/Ni multilayer before the reaction. We fabricate an Al/Ni film in which the outermost Al or Ni layer is deposited more thickly. By the laser flash method with response function analysis, the thermal resistance of the bonded specimens was measured in the case of thickening and non-thickening of the outermost layer. It is found that the resistance decreases with the thickness of the outermost layers, particularly the Ni layer. To investigate the influence of the amount of void on the resistance, scanning acoustic tomography (SAT), scanning electron microscope (SEM) observation, and field-emission electron probe micro-analysis (FE-EPMA) were carried out. Differences in the interfacial state between Ni-thickening and Al-thickening specimens are discussed in light of solder wettability, diffusion into the solder, and the type of intermetallic compound at the solder interface. It can be considered that thickening the outermost Ni layer has a great impact on decreasing the number of voids generated at the AlNi-solder interface even in low-pressure bonding, leading to reduction in the thermal resistance of solder joints. (C) 2017 The Japan Society of Applied Physics