Ultrashallow defect states at SiO2∕4H–SiC interfaces
Ultrashallow defect states at SiO2∕4H–SiC interfaces
复制标题
SiO2∕4H–SiC 界面的超浅缺陷态
DOI:
10.1063/1.2898502
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发表时间:
2008
影响因子:
4
通讯作者:
L. Feldman
中科院分区:
文献类型:
--
作者:
S. Dhar;X. Chen;P. Mooney;J. Williams;L. Feldman
Interface state density (Dit) at SiO2∕4H–SiC interfaces are reported for states lying energetically within ∼0.05–0.2eV of the conduction band edge (EC) of 4H–SiC using capacitance-voltage characterization as a function of temperature. Comparison of as-grown dry oxidized and nitrided interfaces confirms the significant reduction of Dit associated with nitridation. In the as-oxidized case (no nitridation), the Dit in the energy range ∼0.05–0.2eV below EC is found to consist of a broad Dit peak at about ∼0.1eV below EC with an energy width of about ∼0.2eV and a peak magnitude of ∼2×1013cm−2eV−1 superimposed on an exponentially decaying background distribution. Interfacial nitridation completely eliminates the broad peak but does not strongly affect the background.Interface state density (Dit) at SiO2∕4H–SiC interfaces are reported for states lying energetically within ∼0.05–0.2eV of the conduction band edge (EC) of 4H–SiC using capacitance-voltage characterization as a function of temperature. Comparison of as-grown dry oxidized and nitrided interfaces confirms the significant reduction of Dit associated with nitridation. In the as-oxidized case (no nitridation), the Dit in the energy range ∼0.05–0.2eV below EC is found to consist of a broad Dit peak at about ∼0.1eV below EC with an energy width of about ∼0.2eV and a peak magnitude of ∼2×1013cm−2eV−1 superimposed on an exponentially decaying background distribution. Interfacial nitridation completely eliminates the broad peak but does not strongly affect the background.