Evaluation of Oxygen Plasma and UV Ozone Methods for Cleaning of Occluded Areas in MEMS Devices
Evaluation of Oxygen Plasma and UV Ozone Methods for Cleaning of Occluded Areas in MEMS Devices
复制标题
评估用于清洁 MEMS 器件中遮挡区域的氧等离子体和 UV 臭氧方法
DOI：
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发表时间：
2010
影响因子：
2.7
通讯作者：
Michael T. Dugger
中科院分区：
文献类型：
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作者：
D. Adam Hook;James A. Olhausen;J. Krim;Michael T. Dugger
紫外臭氧和氧等离子体处理是清洁硅表面的两种常用程序。通过这些方法清洁微机电系统（MEMS）隐藏表面的程度尚未得到很好的记录。为了探索和比较两种方法清洁MEMS中闭塞区域的有效性，制造了由大型活动皮瓣组成的器件，以产生隐藏表面，其闭塞区域超过了MEMS器件中通常出现的纵横比。在定制皮瓣装置中，皮瓣与基板之间的间隙被设计为在程度上可变。它们的内部区域首先涂上化学吸附的单层膜，然后进行清洗。两种技术都去除暴露表面上的单层，并且在某种程度上都去除存在于遮挡表面上的单层。氧等离子体被发现是一种比紫外臭氧法更有效的清洁闭塞表面的方法。然而，在宽高比为1700:1的异常大的闭塞中，即使氧等离子体也无法去除化学吸收单层的所有痕迹。
UV ozone and oxygen plasma treatments are two common procedures for cleaning silicon surfaces. The extent to which hidden surfaces of microelectromechanical systems (MEMS) are cleaned by these methods has not been well documented. To probe and compare the effectiveness of the two methods for cleaning occluded regions in MEMS, devices consisting of large movable flaps were fabricated to produce hidden surfaces whose occluded regions exceeded the aspect ratios that typically occur in MEMS devices. The gaps between the flap and the substrate in the custom flap devices were designed to be variable in extent. Their interior regions were initially coated with chemisorbed monolayers and then subjected to cleaning. Both techniques removed monolayers on exposed surfaces and both, to some extent, removed monolayers present on the occluded surfaces. Oxygen plasma was found to be a far more effective method for cleaning the occluded surfaces than the UV ozone method. However, in occlusions with exceptionally large aspect ratios of 1700 : 1, even oxygen plasma could not remove all traces of the chemisorbed monolayers.