TEM ANALYSIS OF DIFFUSION-BONDED SILICON CARBIDE CERAMICS JOINED USING METALLIC INTERLAYERS

TEM ANALYSIS OF DIFFUSION-BONDED SILICON CARBIDE CERAMICS JOINED USING METALLIC INTERLAYERS
复制标题

使用金属中间层连接的扩散结合碳化硅陶瓷的 TEM 分析

DOI：
--
复制
发表时间：
2017
期刊：
Ceramic Engineering and Science Proceedings (CESP), Proceedings of the 41th International Conference on Advanced Ceramics and Composites (ICACC2017)
影响因子：
--
通讯作者：
R. Asthana and M. Singh
R. Asthana and M. Singh
中科院分区：
--
文献类型：
--
作者：
T. Ozaki;Y. Hasegawa;H. Tsuda;S. Mori;M. C. Halbig;R. Asthana and M. Singh

文献摘要

相似文献