Ablation of Submicrometer Holes Using an Extreme-Ultraviolet Laser
Ablation of Submicrometer Holes Using an Extreme-Ultraviolet Laser
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DOI：
10.1103/physrevapplied.3.064013
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发表时间：
2015-06
影响因子：
4.6
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中科院分区：
文献类型：
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采用模拟和实验方法研究了极紫外激光钻亚微米孔。用二维欧拉流体动力学程序研究了烧蚀过程，其中包括与EUV激光器与固体材料相互作用相关的无束缚吸收过程。在目标辐照度高达1×1010 W cm−2的情况下，模拟和测量的烧蚀深度之间有很好的一致性。当辐照度增加到1×1012 W cm−2时，单脉冲可将材料烧蚀至3.8 μm深，孔径为焦斑尺寸的3 ~ 4倍。该模型允许模拟激光脉冲与先前射击产生的陨石坑的相互作用。在优化的聚焦条件下，即接近衍射极限的多脉冲低通量辐照配置，对于需要中尺度[(100 nm) - (1 μm)]特征和对烧蚀剖面的高水平控制的应用是有利的。
Simulations and experiments are used to study extreme-ultraviolet (EUV) laser drilling of submicrometer holes. The ablation process is studied with a 2D Eulerian hydrodynamic code that includes bound-free absorption processes relevant to the interaction of EUV lasers with a solid material. Good agreement is observed between the simulated and measured ablated depths for on-target irradiances of up to 1×1010 W cm−2. An increase in the irradiance to 1×1012 W cm−2 is predicted to ablate material to a depth of 3.8 μm from a single pulse with a hole diameter 3 to 4 times larger than the focal spot size. The model allows for the simulation of the interaction of a laser pulse with the crater created by a previous shot. Multiple-pulse lower-fluence irradiation configurations under optimized focusing conditions, i.e., approaching the diffraction limit, are shown to be advantageous for applications requiring mesoscale [(100 nm)–(1 μm)] features and a high level of control over the ablation profile.