Bias influence on titanium interlayer for titanium nitride films
Bias influence on titanium interlayer for titanium nitride films
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DOI：
10.1179/1743294415y.0000000097
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发表时间：
2016-02
影响因子：
2.8
通讯作者：
G. Lain;F. Cemin;C. M. Menezes;C. Aguzzoli;Israel J.R. Baumvol;S. S. Tomiello-S.;C. A. Figueroa
中科院分区：
文献类型：
--
作者：
G. Lain;F. Cemin;C. M. Menezes;C. Aguzzoli;Israel J.R. Baumvol;S. S. Tomiello-S.;C. A. Figueroa
本文研究了用阴极电弧蒸发法在不锈钢AISI 304基体上沉积TiN薄膜的工艺。在Ti层间沉积期间在衬底上施加的偏压是变化的，并且确定了几种性质。采用辉光放电发射光谱、掠射角X射线衍射和扫描电子显微镜技术分别分析了其化学成分、晶体结构和显微组织性能。此外，纳米压痕和滑动测试进行，以评估TiN薄膜的硬度和耐刮擦性。结果表明，在Ti层间沉积步骤中施加的偏压可以改变TiN薄膜的某些性质。实际上，在Ti夹层沉积期间，在较高的施加偏压下实现了较低的氧含量和较高的临界载荷以开始TiN薄膜的塑性变形（耐刮擦性）。较高的耐刮擦性能够赋予用于装饰应用的金属件长期耐久性。
This work investigates the deposition of TiN thin films by cathodic arc evaporation on stainless steel AISI 304 substrate for decorative applications. The applied voltage bias on the substrate during the Ti interlayer deposition was varied, and several properties were determined. The chemical profile, crystalline structure and microstructural properties were analysed by glow discharge optical emission spectroscopy, glancing angle X-ray diffraction and SEM techniques respectively. In addition, nanoindentation and sliding tests were performed in order to evaluate the hardness and scratch resistance of TiN thin films. The results showed that the applied voltage bias during the Ti interlayer deposition step could modify some properties of the TiN thin films. Indeed, lower oxygen contents and higher critical loads to start a plastic deformation (scratch resistance) of the TiN thin films are achieved at higher applied voltage biases during the Ti interlayer deposition. A higher scratch resistance is capable of imparting a long term durability of metallic pieces for decorative applications.