Low-temperature direct bonding of glass nanofluidic chips using a two-step plasma surface activation process
Low-temperature direct bonding of glass nanofluidic chips using a two-step plasma surface activation process
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DOI：
10.1007/s00216-011-5574-2
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发表时间：
2011
影响因子：
4.3
通讯作者：
Yan Xu;Chenxi Wang;Yiyang Dong;Lixiao Li;Kihoon Jang;K. Mawatari;T. Suga;T. Kitamori
中科院分区：
文献类型：
--
作者：
Yan Xu;Chenxi Wang;Yiyang Dong;Lixiao Li;Kihoon Jang;K. Mawatari;T. Suga;T. Kitamori
由于在2D纳米尺度上具有高分辨率、再现性和灵活性的成熟的纳米通道制造技术，玻璃是用于制造纳米流体芯片的领先的、理想的和不可替代的材料。然而，在传统的熔融键合工艺中，通常需要高温（~ 1，000 °C）和真空条件，不幸的是，这阻碍了纳米流体应用甚至整个纳米流体领域的发展。我们提出了一种在低温下，在环境空气中约200 °C，通过两步等离子体表面活化过程，其中包括O2反应离子蚀刻等离子体处理，然后氮气微波自由基活化的熔融石英玻璃纳米流体芯片的直接键合。低温键合的玻璃纳米流控芯片不仅具有较高的键合强度，而且在450 kPa的气压驱动下也能连续工作，无泄漏，可以满足大多数纳米流控操作的要求。由于键合过程中所需的温和条件，该方法有可能允许在制造过程中将一系列功能元件集成到纳米流体芯片中，这在传统的高温熔融键合过程中几乎是不可能的。因此，我们相信所开发的低温键合将非常有用，并有助于纳米流体领域。图通过两步等离子体表面活化工艺，在环境空气中约200 °C的低温下直接键合熔融石英玻璃纳米流体芯片，该工艺由O2 RIE等离子体处理和随后的氮MW自由基活化组成
Owing to the well-established nanochannel fabrication technology in 2D nanoscales with high resolution, reproducibility, and flexibility, glass is the leading, ideal, and unsubstitutable material for the fabrication of nanofluidic chips. However, high temperature (~1,000 °C) and a vacuum condition are usually required in the conventional fusion bonding process, unfortunately impeding the nanofluidic applications and even the development of the whole field of nanofluidics. We present a direct bonding of fused silica glass nanofluidic chips at low temperature, around 200 °C in ambient air, through a two-step plasma surface activation process which consists of an O2reactive ion etching plasma treatment followed by a nitrogen microwave radical activation. The low-temperature bonded glass nanofluidic chips not only had high bonding strength but also could work continuously without leakage during liquid introduction driven by air pressure even at 450 kPa, a very high pressure which can meet the requirements of most nanofluidic operations. Owing to the mild conditions required in the bonding process, the method has the potential to allow the integration of a range of functional elements into nanofluidic chips during manufacture, which is nearly impossible in the conventional high-temperature fusion bonding process. Therefore, we believe that the developed low-temperature bonding would be very useful and contribute to the field of nanofluidics.FigureDirect bonding of fused silica glass nanofluidic chips at low temperature, around 200 °C in ambient air, through a two-step plasma surface activation process which consists of an O2RIE plasma treatment followed by a nitrogen MW radical activation