Fracture and Delamination of Chromium Thin Films on Polymer Substrates
Fracture and Delamination of Chromium Thin Films on Polymer Substrates
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DOI：
10.1007/s11661-009-9988-9
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发表时间：
2010-04-01
影响因子：
2.8
通讯作者：
Dehm, G.
中科院分区：
文献类型：
--
作者：
Cordill, M. J.;Taylor, A.;Dehm, G.
柔性电子设备领域的新兴技术要求金属薄膜与聚合物基材良好粘合并弯曲。用于这些应用的常见薄膜材料包括带有铬 (Cr) 粘合夹层的铜 (Cu)。铜具有很好的延展性，很容易随聚合物基材移动。然而，Cr 比 Cu 更脆，并且在较低应变下会断裂。本研究旨在检查聚酰亚胺 (PI) 上应变铬膜的断裂以及随后的屈曲和分层。原位扫描电子显微镜（SEM）应变用于系统研究膜厚度对断裂应变和屈曲应变的影响。薄膜断裂和分层取决于薄膜厚度，并且通过剪切滞后模型探索裂纹和屈曲密度随着厚度的减小而增加。
New emerging technologies in the field of flexible electronic devices require that metal films adhere well and flex with polymer substrates. Common thin film materials used for these applications include copper (Cu) with an adhesion interlayer of chromium (Cr). Copper can be quite ductile and easily move with the polymer substrate. However, Cr is more brittle and fractures at lower strains than Cu. This study aims to examine the fracture and subsequent buckling and delamination of strained Cr films on polyimide (PI). In-situ scanning electron microscope (SEM) straining is used to systematically study the influence of film thickness on fracture and buckling strains. Film fracture and delamination depend on film thickness, and increases in crack and buckle density with decreasing thickness are explored by a shear lag model.