Elaboration of Cu−Pd Films by Coelectrodeposition: Application to Nitrate Electroreduction
Elaboration of Cu−Pd Films by Coelectrodeposition: Application to Nitrate Electroreduction
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DOI:
10.1021/jp805484t
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发表时间:
2009-01
影响因子:
3.7
通讯作者:
D. Reyter;D. Bélanger;L. Roué
中科院分区:
文献类型:
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作者:
D. Reyter;D. Bélanger;L. Roué
In this study, nanocrystalline copper−palladium films were synthesized over a wide range of compositions by coelectrodeposition of Pd and Cu in a 1 M NaCl solution containing both CuCl2 and PdCl2 in various proportions. The deposition potential was fixed at −0.5 V versus a saturated calomel electrode (SCE). These coatings were characterized by scanning electron microscopy coupled to energy dispersive X-ray analysis (SEM−EDX), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). These analyses revealed a fine and homogeneous distribution of Pd and Cu within and over the whole surface of the film. Depending upon the Cu(II)/Pd(II) ratio in solution, monophased Pd-rich films (Pd95Cu5 or Pd88Cu12 alloys) or biphased films (containing Pd80Cu20 and Cu phases in different proportions) were obtained. Theses materials were tested as electrocatalysts for nitrate reduction in alkaline media. Electrochemical measurements showed that biphasic (Pd80Cu20 + Cu) materials displayed the best electrocatalytic...