Study of the mechanical and microstructural state of platinum thin films
Study of the mechanical and microstructural state of platinum thin films
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DOI：
10.1016/0040-6090(95)07011-7
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发表时间：
1996-04-01
期刊：
影响因子：
2.1
通讯作者：
Goudeau, P
中科院分区：
文献类型：
--
作者：
Branger, V;Pelosin, V;Goudeau, P
用x射线衍射仪和振动簧片装置对电子束蒸发沉积在氧化硅衬底上的多晶铂薄膜的微观结构和力学状态进行了表征。传统的sin(2) psi方法表明，薄膜具有拉伸残余应力，且未应变晶格参数值低于本体参数值。利用Warren-Averbach和积分宽度方法，获得了150 nm厚薄膜的相干衍射畴大小（约5 nm）和微畸变（0.3%）。在热循环过程中，在300 K和800 K之间测量了内摩擦，表明在650 K和800 K之间退火大大降低了阻尼水平。通过等温实验，我们确定了结构演化过程的激活焓。计算的能量和互补显微图（TEM）使我们能够假设观察到的机制与位于晶界的微观结构重排密切相关。
The microstructural and mechanical state of polycrystalline Pt thin films deposited by electron beam evaporation on oxidised Si substrates have been characterised using an X-ray diffraction diffractometer and a vibrating-reed device. The conventional sin(2) psi method shows that films exhibit tensile residual stresses and the value of the unstrained lattice parameter is lower than the bulk one. The size of the coherently diffracting domains (approximate to 5 nm) and microdistortions (0.3%) in a 150 nm thick film are obtained using the Warren-Averbach and integral width methods. Internal friction has been measured between 300 K and 800 K during thermal cycling, showing that the damping level is considerably reduced by annealing between 650 K and 800 K. Thanks to isothermal experiments, we have determined the activation enthalpy of the process involved in the structural evolution. The calculated energies and complementary micrographs (TEM) enable us to assume that the observed mechanism is closely related to microstructural rearrangements located at grain boundaries.