ULTRASONIC-DETECTION OF KISSING BONDS AT ADHESIVE INTERFACES
ULTRASONIC-DETECTION OF KISSING BONDS AT ADHESIVE INTERFACES
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DOI：
10.1163/156856191x00521
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发表时间：
1991-01-01
影响因子：
2.3
通讯作者：
NAGY, PB
中科院分区：
文献类型：
--
作者：
NAGY, PB
粘合剂和被粘物对应物之间很容易发生紧密的机械接触，而无需实际粘合。 这种表面上完美无缺但有严重缺陷的“接吻”键尤其危险，因为它们通常无法被大多数类型的传统超声波检查所发现。 建议采用特殊的高频、高检查角度超声波技术来提高这种接吻键的可检测性。 事实证明，必须从被粘物侧询问粘合剂-被粘物界面，而不通过固有不均匀且高度衰减的粘合剂层发送超声波。
Intimate mechanical contact between the adhesive and adherend counterparts can easily occur without an actual bond. Such apparently flawless, but severely defective 'kissing' bonds are especially dangerous because they often remain hidden from most types of conventional ultrasonic inspection. A special high-frequency, high-inspection angle ultrasonic technique is suggested to improve the detectability of such kissing bonds. It is shown to be essential to interrogate the adhesive-adherend interface from the adherend side without sending the ultrasound through the inherently inhomogeneous and highly attenuating adhesive layer.