Inter-relationship of stress and microstructure in BCC and ‘beta’ tungsten films
Inter-relationship of stress and microstructure in BCC and ‘beta’ tungsten films
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BCC 和 β 钨薄膜中应力与微观结构的相互关系
DOI:
10.1016/j.surfcoat.2023.129336
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发表时间:
2023
影响因子:
5.4
通讯作者:
Thompson, Gregory B.
中科院分区:
文献类型:
--
作者:
Johnson, Jonathan A.;Su, Tong;Chason, Eric;Thompson, Gregory B.
In this work, a series of W films are deposited at different deposition rates (0.2, 0.5, and 1.0 nm/s) and pressures (0.27, 0.47, 0.67, and 1.33 Pa). Comparing the residual stresses between different deposition rates, the stress was found to become more tensile at higher depositions rates over the pressure ranges studied. Films deposited at the three highest pressures were tensile in stress, had small grains (~15 to 20 nm), and stabilized the metastable A15 phase often referred to as β-W. At the lowest pressure, 0.27 Pa, the films were compressive in stress, larger grain sizes (~70 to 90 nm), and primarily stabilized the body centered cubic α-W phase. If a W seed layer was grown under either the α-W or β-W growth conditions, the subsequent W layer adopted the phase state of the seed layer, independent of processing conditions and/or grain sizes, suggesting that the phase state is most likely determined in the initial stages of nucleation. The seed layer experiment also suggest that these layers can promote more controlled grain sizes in thicker β-W films, which has not been observed in previous work. The stress measurements are interpreted in terms of a previously developed kinetic model that includes effects of growth kinetics, microstructural evolution, and energetic particle bombardment.