ICP polishing of silicon for high-quality optical resonators on a chip
ICP polishing of silicon for high-quality optical resonators on a chip
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DOI：
10.1088/0960-1317/22/12/125011
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发表时间：
2012-08
影响因子：
2.3
通讯作者：
A. Laliotis;M. Trupke;J. Cotter;G. Lewis;M. Kraft;E. Hinds
中科院分区：
文献类型：
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作者：
A. Laliotis;M. Trupke;J. Cotter;G. Lewis;M. Kraft;E. Hinds
通过圆形掩模对硅进行湿法蚀刻而制成的微型凹空洞可用作在芯片上构建光学微腔的镜子基板。在本文中，我们研究了电感耦合等离子体（ICP）抛光如何改善镜子基板的形状和粗糙度。我们使用白光光学轮廓测定法和原子力显微镜来表征 ICP 抛光过程中表面的演变。表面粗糙度达到 1 nm，涂上高反射率电介质后，表面粗糙度降至 0.5 nm。对于这种光滑的镜子，光学腔的精度现在受到下面镜子的形状的限制。
Miniature concave hollows, made by wet etching silicon through a circular mask, can be used as mirror substrates for building optical micro-cavities on a chip. In this paper, we investigate how inductively coupled plasma (ICP) polishing improves both shape and roughness of the mirror substrates. We characterize the evolution of the surfaces during the ICP polishing using white-light optical profilometry and atomic force microscopy. A surface roughness of 1 nm is reached, which reduces to 0.5 nm after coating with a high reflectivity dielectric. With such smooth mirrors, the optical cavity finesse is now limited by the shape of the underlying mirror.