Scanning tunneling microscopy and spectroscopy for studying cross-sectioned Si(100)
Scanning tunneling microscopy and spectroscopy for studying cross-sectioned Si(100)
复制标题
用于研究横截面 Si(100) 的扫描隧道显微镜和光谱学
DOI:
10.1116/1.586384
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发表时间:
1992
影响因子:
1.4
通讯作者:
J. Halbout
中科院分区:
文献类型:
--
作者:
M. Johnson;J. Halbout
Scanning tunneling microscopy (STM) and scanning tunneling spectroscopy (STS) are used to investigate a cross‐sectional surface of Si(100) prepared by an ex situ cleave HF‐dip technique. The agreement between the measured current–voltage spectra (I/Vs) and those calculated with an unpinned surface for both n‐ and p‐type bulk surfaces is good, thus indicating that the prepared surface is unpinned and the model is valid. Both the experimental and calculated I/Vs show three components of current: tunneling out of valence‐band states (VB), tunneling through dopant states (D), and tunneling into conduction‐band states (CB). As demonstrated by experiment, in agreement with the model, the shape of the I/Vs allows the discrimination of n‐type from p‐type surfaces. Furthermore, the model indicates that by measuring the dopant state current D‐component STM/STS is sensitive to the carrier density within the range of 1018–1021 cm−3. This suggests that this ex situ cleave sample preparation can be used to produce unpi...