Three-dimensional imaging using fast micromachined electro-absorptive shutter
Three-dimensional imaging using fast micromachined electro-absorptive shutter
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DOI:
10.1117/1.jmm.12.2.023011
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发表时间:
2013-04-01
影响因子:
2
通讯作者:
Lee, Yong Tak
中科院分区:
文献类型:
--
作者:
Park, Yong-Hwa;Cho, Yong-Chul;Lee, Yong Tak
A 20-MHz switching high-speed light-modulating device for three-dimensional (3-D) image capturing and its system prototype are presented. For 3-D image capturing, the system utilizes a time-of-flight (TOF) principle by means of a 20-MHz high-speed micromachined electro-absorptive modulator, the so-called optical shutter. The high-speed modulation is obtained by utilizing the electro-absorption mechanism of the multilayer structure, which has an optical resonance cavity and light-absorption epilayers grown by metal organic chemical vapor deposition process. The optical shutter device is specially designed to have small resistor-capacitor-time constant to get the high-speed modulation. The optical shutter is positioned in front of a standard high-resolution complementary metal oxide semiconductor image sensor. The optical shutter modulates the incoming infrared image to acquire the depth image. The suggested novel optical shutter device enables capturing of a full high resolution-depth image, which has been limited to video graphics array (VGA) by previous depth-capturing technologies. The suggested 3-D image sensing device can have a crucial impact on 3-D-related business such as 3-D cameras, gesture recognition, user interfaces, and 3-D displays. This paper presents micro-opto-electro-mechanical systems-based optical shutter design, fabrication, characterization, 3-D camera system prototype, and image evaluation. (C) The Authors. Published by SPIE under a Creative Commons Attribution 3.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.