Predictive modeling of force and power based on a new analytical undeformed chip thickness model in ceramic grinding
Predictive modeling of force and power based on a new analytical undeformed chip thickness model in ceramic grinding
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DOI：
10.1016/j.ijmachtools.2012.10.006
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发表时间：
2013-02-01
影响因子：
14
通讯作者：
Rao, P. Venkateswara
中科院分区：
文献类型：
--
作者：
Agarwal, Sanjay;Rao, P. Venkateswara
磨削力和磨削功率在陶瓷磨削过程中起着重要的作用，不仅直接影响砂轮的磨损、磨削精度、磨削温度和表面完整性，而且对局部接触挠度和接触挠度的性质也有很强的影响，对材料的去除机理有重要影响。此外，它们对陶瓷磨削过程的优化、监测和控制也具有重要意义。因此，陶瓷磨削过程中磨削力和磨削功率的预测是十分必要的。但是，力和功率受多种因素的影响，实验测定力和功率费力且耗时。因此，建立可靠的磨削力和磨削功率预测模型仍然是陶瓷磨削的关键问题。为了可靠地预测陶瓷磨削中的磨削力和磨削功率，本文基于一种新的解析式无变形切屑厚度模型，建立了一种新的磨削力和磨削功率模型。基于磨削过程的随机性，主要受随机几何形状和切削刃的随机分布控制，建立了一种新的解析型不变形切屑厚度模型。该模型包括由轮-工件接触区挠曲引起的组合接触长度、由晶粒级微观接触引起的局部挠曲引起的实际接触长度以及由切削深度几何形状引起的接触长度。该模型用于平面磨削总磨削力和磨削功率的预测。在卧式平面磨床上进行了金刚石砂轮磨削碳化硅的实验，验证了该模型的有效性。结果表明，该模型与不同运动条件下的实验数据吻合较好。在相同操作条件下，与基于现有未变形切屑厚度模型开发的磨削力模型相比，该方法可显著减小磨削力。(C) 2012 Elsevier Ltd.版权所有。
The grinding force and power play an important role in ceramic grinding process as they not only have the direct influence on the wheel wear, grinding accuracy, grinding temperature and surface integrity but also have strong influence on local contact deflection and the nature of the contact deflection that has an important effect on the mechanism of material removal. In addition, they are also important to many aspects of ceramic grinding process optimization, monitoring, and control. So the prediction of grinding force and power in ceramic grinding is essential. But, the force and power is governed by many factors and its experimental determination is laborious and time consuming. So the establishment of a model for the reliable prediction of grinding force and power is still a key issue for ceramic grinding. In this study, a new grinding force and power model is developed, for the reliable prediction of grinding force and power in ceramic grinding, based on a new analytical undeformed chip thickness model. This new analytical undeformed chip thickness model is developed on the basis of stochastic nature of the grinding process, governed mainly by the random geometry and the random distribution of cutting edges. The model includes the real contact length that results from combined contact length, due to wheel-workpiece contact zone deflection and the local deflection due to the microscopic contact at the grain level and contact length due to geometry of depth of cut. The proposed model is used to predict the total grinding forces and power in surface grinding. The new model has been validated by conducting experiments on a horizontal surface grinding machine by grinding silicon carbide with diamond grinding wheel. Results indicate that the proposed model shows a good agreement with the experimental data obtained from different kinematic conditions. It also results in a significant reduction in the grinding forces, as compared with that obtained by the force model developed based on the existing undeformed chip thickness model, under the same operating conditions, in silicon carbide grinding. (C) 2012 Elsevier Ltd. All rights reserved.