Evaluation of Strained Group IV Semiconductor Devices by Oil-Immersion Raman Spectroscopy
Evaluation of Strained Group IV Semiconductor Devices by Oil-Immersion Raman Spectroscopy
复制标题
通过油浸拉曼光谱评估应变 IV 族半导体器件
DOI:
10.1149/10904.0351ecst
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发表时间:
2022
期刊:
影响因子:
--
通讯作者:
and A. Ogura
中科院分区:
文献类型:
--
作者:
R. Yokogawa;C. -T. Chen;K. Toprasertpong;M. Takenaka;S. Takagi;and A. Ogura
Background and purposeStrain technique is one of the principal technology boosters for the realization of high-performance logic devices composed of group IV semiconductors such as silicon (Si), germanium (Ge), and SiGe alloy. In particular, strain engineering plays an important role in improving the performance of metal-oxide semiconductor field-effect transistors (MOSFETs) until now from the viewpoint of reducing the effective carrier mass [1-3]. It is gradually indispensable to evaluate and understand the applied strain in group IV semiconductor devices for the optimization of the carrier mobility and the device structure.Several strain evaluation techniques such as X-ray diffraction (XRD)[4], convergent-beam electron diffraction [5], and electron backscattering pattern [6], have been proposed and put into practical use. Raman spectroscopy is one of the most powerful techniques for phonon energy measurements. Phonon energy (Raman shift) is closely related to strain and stress states. The accurate strain measurement can be performed with high-spatial resolution nondestructive, and high throughput. However, conventional Raman spectroscopy is limited in strain information based on the Raman polarization selection rules [7]. Raman measurement is often applied under the (001) group IV semiconductors backscattering geometry. This configuration cannot allow to perform the complicated stress measurement such as anisotropic biaxial stress states. In this paper, we show stress evaluation of strained group IV semiconductor devices by oil-immersion Raman spectroscopy with the high-numerical-aperture (high-