Crack analysis in bimaterial interfaces using T-spline based XIGA
Crack analysis in bimaterial interfaces using T-spline based XIGA
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DOI：
10.15632/jtam-pl.55.1.55
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发表时间：
2017-01
影响因子：
0.7
通讯作者：
S. H. Habib;I. Belaidi
中科院分区：
文献类型：
--
作者：
S. H. Habib;I. Belaidi
在扩展等几何分析（XIGA）的框架内，适合分析的T样条用于双材料界面裂纹的建模和分析。采用双材料界面裂纹尖端富集函数来再现奇异场，并采用带符号距离函数来处理模型中的裂纹面和界面。采用一种相容的局部细化算法对裂纹和界面位置进行细化，避免了控制点的过度扩展。采用由相互作用积分（M积分）计算的混合型应力强度因子（SIF）作为分析参数。数值模拟进行分析的问题，并检查所提出的方法的效率。所得结果与其他可用的结果进行了比较。
Analysis-suitable T-splines are used for the modeling and analyzing of cracks in bimaterial interfaces within the framework of an extended isogeometric analysis (XIGA). The crack tip enrichment functions of bimaterial interface cracks are implemented to reproduce singular fields, and the signed distance functions are used to treat the crack face and the interface in the models. A compatible local refinement algorithm is applied to refine location of the crack and the interface, which helps one to avoid produce excessive propagation of control points. The mixed mode stress intensity factors (SIFs) which are evaluated by the interaction integral (M-integral) are used as analysis parameters. Numerical simulations are performed to analyze the problem and to examine the efficiency of the proposed method. The obtained results are compared with other available results.