Peak amplitude of target current determines deposition rate loss during high power pulsed magnetron sputtering
Peak amplitude of target current determines deposition rate loss during high power pulsed magnetron sputtering
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DOI:
10.1016/j.vacuum.2015.11.004
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发表时间:
2016-02-01
期刊:
影响因子:
4
通讯作者:
Hultman, L.
中科院分区:
文献类型:
--
作者:
Greczynski, G.;Hultman, L.
Film growth rates during DCMS and HIPIMS sputtering in Ar are measured for ten technologically relevant elemental target materials: Al, Si, Ti, Cr, Y, Zr, Nb, Hf, Ta, and W, spanning wide range of masses, ionization energies, and sputter yields. Surprisingly, the ratio of power-normalized HIPIMS and DCMS rates a decays exponentially with increasing peak target current density J(T)(max) for all metals. The effect of J(T)(max) on alpha is dramatic: alpha approximate to 1 in the limit of lowest J(T)(max) values tested (0.04 A/cm(2)) and decreases to only 0.12 with J(T)(max) similar to 3 A/cm(2). With the exception of Al and Si, alpha(J(T)(max)) curves overlap indicating that the debated rate loss in HIPIMS is to large extent determined by the peak amplitude of the HIPIMS target current for all tested metals. Back attraction of ionized target species is responsible for such large variation in a. (C) 2015 Elsevier Ltd. All rights reserved.