3D Printing of Freestanding MXene Architectures for Current‐Collector‐Free Supercapacitors
3D Printing of Freestanding MXene Architectures for Current‐Collector‐Free Supercapacitors
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DOI：
10.1002/adma.201902725
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发表时间：
2019-07
影响因子：
29.4
通讯作者：
Wenji Yang;Jie Yang;J. Byun;F. P. Moissinac;Jiaqi Xu;S. Haigh;M. Domingos;M. Bissett;R. Dryfe-R
中科院分区：
文献类型：
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作者：
Wenji Yang;Jie Yang;J. Byun;F. P. Moissinac;Jiaqi Xu;S. Haigh;M. Domingos;M. Bissett;R. Dryfe-R
增材制造（AM）技术作为电化学能量存储（EES）设备的可扩展制造的范例出现，其中通常需要复杂的3D架构，但使用传统技术难以实现。这些技术和创新材料配方的组合，最大限度地提高表面积的可达性和电极内的离子传输，同时最大限度地减少空间越来越感兴趣。在本文中，由具有约8 μm的大横向尺寸的原子级薄（1-3 nm）2D Ti 3C 2 Tx组成的水性油墨具有理想的粘弹性，被配制用于基于挤出的独立式高比表面积架构的3D打印，以确定制造能量存储装置的可行性。该3D打印器件在1.7 mA cm−2下实现了2.1 F cm−2的高面积电容，在0.2 A g−1下实现了242.5 F g−1的重量电容，并在10000次循环中保持了90%以上的电容。它还具有0.0244 mWh cm−2的高能量密度和0.64 mW cm − 2的功率密度（4.3 mA cm−2）。预计在这项工作中开发的可持续印刷和设计方法可以应用于制造高性能定制的多尺度和多维结构的功能和结构材料，用于各种应用中的集成设备。
Additive manufacturing (AM) technologies appear as a paradigm for scalable manufacture of electrochemical energy storage (EES) devices, where complex 3D architectures are typically required but are hard to achieve using conventional techniques. The combination of these technologies and innovative material formulations that maximize surface area accessibility and ion transport within electrodes while minimizing space are of growing interest. Herein, aqueous inks composed of atomically thin (1–3 nm) 2D Ti3C2Tx with large lateral size of about 8 µm possessing ideal viscoelastic properties are formulated for extrusion‐based 3D printing of freestanding, high specific surface area architectures to determine the viability of manufacturing energy storage devices. The 3D‐printed device achieves a high areal capacitance of 2.1 F cm−2 at 1.7 mA cm−2 and a gravimetric capacitance of 242.5 F g−1 at 0.2 A g−1 with a retention of above 90% capacitance for 10 000 cycles. It also exhibits a high energy density of 0.0244 mWh cm−2 and a power density of 0.64 mW cm−2 at 4.3 mA cm−2. It is anticipated that the sustainable printing and design approach developed in this work can be applied to fabricate high‐performance bespoke multiscale and multidimensional architectures of functional and structural materials for integrated devices in various applications.