Fabrication of Cu-CNT Composite and Cu Using Laser Powder Bed Fusion Additive Manufacturing
Fabrication of Cu-CNT Composite and Cu Using Laser Powder Bed Fusion Additive Manufacturing
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DOI：
10.3390/powders1040014
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发表时间：
2022-10
期刊：
影响因子：
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通讯作者：
L. Ladani;J. Razmi;Maryam Sadeghilaridjani
中科院分区：
文献类型：
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作者：
L. Ladani;J. Razmi;Maryam Sadeghilaridjani
增材制造（AM）作为一种颠覆性技术，为航空航天、医疗、核能和能源应用中具有复杂几何形状的许多金属部件的设计和制造提供了巨大的潜力。然而，适合AM工艺的材料数量有限是该技术的缺点之一，特别是铜（Cu）的激光AM由于其高导热性和光学反射率而具有挑战性，这需要更高的热量输入来熔化粉末。使用增材制造复合材料也非常具有挑战性，并且使用当前的粉末床技术不容易实现。本文研究了采用激光粉末床熔融增材制造（LPBF-AM）制备纯铜和铜碳纳米管（Cu- cnt）复合材料的可行性，并通过实验设计（DoE）在三个水平上改变三个参数：激光功率、激光速度和舱口间距，制备了10 × 10 × 10 mm3的Cu和Cu- cnt立方体。Cu和Cu- cnt样品的相对密度分别达到90%和80%以上。每个样品进行3次密度测量，误差小于0.1%。粗糙度测量在5毫米长度的样品上进行，以获得具有统计学意义的结果。Cu的平均表面粗糙度Ra小于20µm；然而，AM Cu-CNT样品的表面粗糙度值高达1 mm。由于其多孔结构，Cu在室温下的导热系数为~108 W/m·K，电导率为~20% IACS（国际退火铜标准），比常规制备的块状Cu低~70%和~80%。室温下Cu-CNT复合材料的导热系数和电导率分别为~85 W/m·K和~10% IACS。在373 K至873 K的温度范围内，Cu- cnts的导热系数高于Cu。多孔Cu和Cu- cnt材料具有表面积大、重量轻、吸能性能好等优点，可用于电极、催化剂及其载体、电容器、热交换器、热吸收和冲击吸收等领域。
Additive manufacturing (AM) as a disruptive technique has offered great potential to design and fabricate many metallic components for aerospace, medical, nuclear, and energy applications where parts have complex geometry. However, a limited number of materials suitable for the AM process is one of the shortcomings of this technique, in particular laser AM of copper (Cu) is challenging due to its high thermal conductivity and optical reflectivity, which requires higher heat input to melt powders. Fabrication of composites using AM is also very challenging and not easily achievable using the current powder bed technologies. Here, the feasibility to fabricate pure copper and copper-carbon nanotube (Cu-CNT) composites was investigated using laser powder bed fusion additive manufacturing (LPBF-AM), and 10 × 10 × 10 mm3 cubes of Cu and Cu-CNTs were made by applying a Design of Experiment (DoE) varying three parameters: laser power, laser speed, and hatch spacing at three levels. For both Cu and Cu-CNT samples, relative density above 90% and 80% were achieved, respectively. Density measurement was carried out three times for each sample, and the error was found to be less than 0.1%. Roughness measurement was performed on a 5 mm length of the sample to obtain statistically significant results. As-built Cu showed average surface roughness (Ra) below 20 µm; however, the surface of AM Cu-CNT samples showed roughness values as large as 1 mm. Due to its porous structure, the as-built Cu showed thermal conductivity of ~108 W/m·K and electrical conductivity of ~20% IACS (International Annealed Copper Standard) at room temperature, ~70% and ~80% lower than those of conventionally fabricated bulk Cu. Thermal conductivity and electrical conductivity were ~85 W/m·K and ~10% IACS for as-built Cu-CNT composites at room temperature. As-built Cu-CNTs showed higher thermal conductivity as compared to as-built Cu at a temperature range from 373 K to 873 K. Because of their large surface area, light weight, and large energy absorbing behavior, porous Cu and Cu-CNT materials can be used in electrodes, catalysts and their carriers, capacitors, heat exchangers, and heat and impact absorption.