Reducing Residual Strain in Fiber Bragg Grating Temperature Sensors Embedded in Carbon Fiber Reinforced Polymers
Reducing Residual Strain in Fiber Bragg Grating Temperature Sensors Embedded in Carbon Fiber Reinforced Polymers
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DOI：
10.1109/jlt.2019.2915622
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发表时间：
2019-09
影响因子：
4.7
通讯作者：
P. Zhu;Jiang Wu;Mengjiao Huang;Yetian Wang;Pan Liu;M. Soto
中科院分区：
文献类型：
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作者：
P. Zhu;Jiang Wu;Mengjiao Huang;Yetian Wang;Pan Liu;M. Soto
研究了嵌入碳纤维增强聚合物（CFRPs）中的光纤布拉格光栅（fbg）的温度响应。为了提供无应变温度测量，在嵌入光纤的两侧和碳纤维预浸料之间放置了两块防粘材料；因此，提供光滑的表面，最大限度地减少应变转移到FBG传感器。实验研究了不同抗粘材料对嵌入式fbg的温度响应和残余弯曲应变响应的影响。结果表明，尽管一些材料可以允许最小的残余应变转移到FBG，但它们的导热性并不总是满足可靠的温度传感要求。结果表明，在测试材料中，铝箔和铜箔均能提供可靠的温度响应（延迟和偏置可忽略不计）和最小的残余应变。利用这种抗粘材料，通过同时对CFRP包装施加温度和弯曲载荷（应变），实验评估了残余应变对FBG温度测量的误差。虽然这里的研究是针对基于fbg的点传感器进行的，但大多数结果和结论也有望适用于受应变-温度交叉灵敏度问题影响的嵌入式分布式光纤传感器的应用。
The temperature response of fiber Bragg gratings (FBGs) embedded in carbon fiber reinforce polymers (CFRPs) is investigated in this paper. To provide strain-free temperature measurements, two pieces of anti-sticking materials are placed at both sides of the embedded optical fiber and between carbon fiber prepregs; thus, providing slippery surfaces that minimize the strain transfer to the FBG sensor. In particular, the impact of different anti-stick materials on the temperature and residual bending strain response of the embedded FBGs is experimentally investigated. Results demonstrate that although some materials can allow for minimum residual strain being transferred to the FBG, their thermal conductivity does not always fulfill the requirements for reliable temperature sensing. It is found out that, among the tested materials, aluminum and copper foils can provide both reliable temperature response (with negligible delay and bias) and minimum residual strain. Using such anti-stick materials, the error induced by the residual strain on FBG temperature measurements is also experimentally evaluated by applying temperature and bending loads (strain) simultaneously to the CFRP packaging. While the study is here performed for FBG-based point sensors, most of the results and conclusions are also expected to be valid for applications of embedded distributed optical fiber sensors being affected by strain-temperature cross-sensitivity issues.