Using spatial information to analyze correlations between test structure data
Using spatial information to analyze correlations between test structure data
复制标题
使用空间信息分析测试结构数据之间的相关性
DOI：
10.1109/66.85943
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发表时间：
1990
期刊：
影响因子：
--
通讯作者：
A. Strojwas
中科院分区：
文献类型：
--
作者：
J. Kibarian;A. Strojwas
一个建模策略，捕获的晶片上的芯片的空间位置上的性能的依赖性。来自该模型的信息可用于确定参数的方差和相关性是由于随机变化还是晶片位置的函数。来自工艺工程师的模拟或知识可用于确定两个参数之间的空间相关性是由于单个潜在原因还是多个原因。空间相关性也可以用来将相关矩阵分成两部分：第一个矩阵将包含由于空间依赖性干扰引起的相关性，第二个矩阵将包含由于非空间依赖性干扰引起的相关性。<<ETX>>
A modeling strategy that captures the dependence of performances on the spatial position of the chips on the wafer is presented. The information from this model can be used to determine whether the variance and correlation of parameters are due to random variation or are a function of wafer position. Simulation or knowledge from process engineers can be used to determine whether the spatial correlation between two parameters is due to a single underlying cause or multiple causes. The spatial correlation can also be used to split the correlation matrix into two parts: the first matrix would contain correlations due to spatially dependent disturbances and the second would contain those due to disturbances not spatially dependent.<<ETX>>