New methods for liquid encapsulation in polymer MEMS structures
New methods for liquid encapsulation in polymer MEMS structures
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聚合物 MEMS 结构中液体封装的新方法
DOI：
10.1109/memsys.2008.4443681
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发表时间：
2008
期刊：
影响因子：
--
通讯作者：
N. Ichikawa
中科院分区：
文献类型：
--
作者：
S. Matsumoto;N. Ichikawa
报道了利用聚合物微机械技术在腔体结构中封装液态材料的两种方法。潜在的应用领域包括具有液基组件的光学器件。现有的大多数液体封装方法都是基于紫外光固化树脂，这迫使对液体的选择和处理进行了限制。所提出的方法分别利用聚合物热键合和粘接，目的是比现有方法更简单和更少的限制。这两种方法分别以去离子水为工作液体进行包埋，以对苯二甲苯为结构聚合物材料进行实验。结果证实了这两种方法的基本概念。讨论了提高长期稳定性的措施。
Two methods for encapsulating liquid phase materials in cavity structures fabricated by polymer MEMS technologies are reported. Potential application fields include optical devices with liquid-base components. Most of existing methods for liquid encapsulation are based on UV-curable resins, which forces restrictions on choice and handling of liquids to be confined. The proposed approaches utilize polymer thermal bonding and stiction, respectively, aiming for more simple and less restrictive processes than the existing methods. Experiments were conducted with these two approaches using DI water as working liquid to be encapsulated, and parylene as structural polymer material. The basic concepts of both methods were confirmed by the results. Measures to improve long term stabilities were discussed.