Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module
Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module
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DOI：
10.1115/1.2429703
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发表时间：
2007-03
影响因子：
1.6
通讯作者：
Y. Pang;E. Scott;J. D. V. Wyk;Z.X. Liang
中科院分区：
文献类型：
--
作者：
Y. Pang;E. Scott;J. D. V. Wyk;Z.X. Liang
电力电子元件中增加的发热会大大降低元件的可靠性，并增加元件故障的机会。充分了解这些组件的热行为有助于确定有效的热管理方案。认识到有源集成电力电子模块的热设计的内在需要，本文评估集成电力电子模块的集成热管理的各种可能性。这些集成热管理策略包括采用高导热性材料以及对当前模块结构的结构修改，同时不增加制造工艺的复杂性以降低成本。
The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding of the thermal behavior of these components can help in deciding an effective thermal management scheme. Recognizing the inherent need for the thermal design of the active integrated power electronics modules, this paper assesses various possibilities of integrated thermal management for integrated power electronics modules. These integrated thermal management strategies include employing high thermal conductivity materials as well as structural modifications to the current module structure while not adding complexity to the fabrication process to reduce the cost.