COPLANAR WAVE-GUIDES FOR MMIC APPLICATIONS - EFFECT OF UPPER SHIELDING, CONDUCTOR BACKING, FINITE-EXTENT GROUND PLANES, AND LINE-TO-LINE COUPLING
COPLANAR WAVE-GUIDES FOR MMIC APPLICATIONS - EFFECT OF UPPER SHIELDING, CONDUCTOR BACKING, FINITE-EXTENT GROUND PLANES, AND LINE-TO-LINE COUPLING
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DOI：
10.1109/tmtt.1987.1133637
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发表时间：
1987-03-01
影响因子：
4.3
通讯作者：
NALDI, CU
中科院分区：
文献类型：
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作者：
GHIONE, G;NALDI, CU
寄生效应发生在GaAs衬底上的微波集成电路的共面波导（CPW）的实际实现，如上屏蔽，导体背衬，有限范围的接地平面的影响，和线到线耦合，进行了讨论和评估。通过精确或近似的保角变换技术，得到了相应波导结构的准TEM电参数的CAD解析表达式。电气性能的差异，相对于理想的CPW的突出，并获得实用的设计标准，以保持覆盖高度，地平面宽度，和线间距的影响最小。
Parasitic effects occurring in actual realizations of coplanar waveguides (CPW) for microwave integrated circuits on GaAs substrates, such as the influence of an upper shield, conductor backing, finite-extent ground planes, and line-to-line coupling, are discussed and evaluated. CAD-oriented analytical expressions are obtained for the electrical quasi-TEM parameters of the relevant waveguiding structures by means of exact or approximate conformal mapping techniques. Differences in electrical behavior with respect to ideal CPW's are highlighted, and practical design criteria are obtained for keeping cover height, ground-plane width, and line-to-line spacing effects to a minimum.